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SOP Last modified: Wednesday, December 21, 2005
Short for Small Outline Package, it's a low-profile rectangular surface-mount component package. Its chip is bonded to an inner land contact area (usually a lead frame). External terminals exit parallel to the seating plane on two opposite sides of the moulded, flat package. SOPs use gull wing formed leads, and is a surface mount package with a fixed lead pitch of .050".
DigChip DigChip.com is a leading provider of electronic components documentation. We offer a reliable tool to find semiconductors components technical information: parts, datasheets, cross reference, obsolete and new circuits. Intel Pentium Processor - Packing Identification Codes The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only. Intel Small Outline Package Guide (PDF) The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface-mount memory packaging from Intel. These Small Outline Packages give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory component densities and features for the user’s applications. Intersil packaging Information Includes information on specific types of Plastic, heretic, and Elantec packages.	Related Categories Hardware Integrated Circuits (ICs) Memory Related Terms 90 nanometer chip controller fab integrated circuit PSOP semiconductor SSOP TSOP