ISP Glossary Find an ISP Term

Search ISP Sites

Search: Search internet.com

ISP Resources ISP-Lists ISP Glossary ISP News CLEC-Planet The List ISPCON Free Newsletter IT Developer Internet News Small Business Personal Technology Search internet.com Advertise Corporate Info Newsletters Tech Jobs E-mail Offers internet.commerce Be a Commerce Partner

Search for an ISP term
by a keyword...	...or by category. choose one... Communications Computer Industry Companies Computer Science Data Graphics Hardware Internet and Online Services Mobile Computing Multimedia Networks Operating Systems Programming Software Standards Types of Computers World Wide Web

SSOP Last modified: Wednesday, December 21, 2005
Short for Shrink Small Outline Package, it's a surface-mount memory packaging from Intel. Key features of the SSOP include the following: JEDEC standard compliance, direction for Intel’s higher-density flash architectures, 0.8 mm (31.5 mil) lead pitch offers handling characteristics similar to 50 mil pitch packages, performance in wide temperature applications, and a two-sided and gull wing lead package design. Intel's SSOP is JEDEC standard. See also Small Outline Package.
DigChip DigChip.com is a leading provider of electronic components documentation. We offer a reliable tool to find semiconductors components technical information: parts, datasheets, cross reference, obsolete and new circuits. Intel Pentium Processor - Packing Identification Codes The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only. Intel Small Outline Package Guide (PDF) The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface-mount memory packaging from Intel. These Small Outline Packages give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory component densities and features for the user’s applications. Intersil packaging Information Includes information on specific types of Plastic, heretic, and Elantec packages.	Related Categories Hardware Integrated Circuits (ICs) Memory Related Terms 90 nanometer chip controller fab integrated circuit Intel JEDEC memory PSOP SOP TSOP